AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface

Masoud Delgosha; Samira Salehi; Leila Unesi borujeni; Soheil Sharifi

doi:doi:10.11648/j.optics.20140302.12

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AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface

Masoud Delgosha, Samira Salehi, Leila Unesi borujeni, Soheil Sharifi

Published in Optics (Volume 3, Issue 2)

Received: 1 July 2014 Accepted: 15 July 2014 Published: 20 July 2014

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Abstract

The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.

Published in	Optics (Volume 3, Issue 2)
DOI	10.11648/j.optics.20140302.12
Page(s)	15-18
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2014. Published by Science Publishing Group

Keywords

Optic, DC Plating, Copper, Morphology, AFM

References

[1]	Tae-Gyu Woo, Il-Song Park, and Kyeong-Won Seol, Effects of Various Metal Seed Layers on the Surface Morphology and Structural Composition of the Electroplated Copper Layer, Met. Mater. Int., Vol. 15, No. 2 (2009), pp. 293~297.
[2]	Tae-Gyu Woo, Il-Song Park, Hyun-Woo Lee, Cheul-Ro Lee and Kyeong-Won Seol, The Effect of Hydroxy Ethyl Cellulose (HEC) and Chloride Ions on the Surface Morphology and Mechanical Characteristics during Copper Electrodeposition, Materials Transactions, Vol. 48, No. 7 (2007) pp. 1913 to 1918.
[3]	Kondo. K, Akolkar. R. N, Barkey. D. P, Masayuki Yokoi, copper Electrodeposition for Nanofabrication of Electronics Devices, Chapter. 2, (2014) pp. 27 to 43, ISBN: 978-1-4614-9175-0.
[4]	NisitTantavichet, Mark D. Pritzker, Effect of plating mode, thiourea and chloride on the morphology of copper deposits produced in acidic sulphate solutions, Electrochimica Acta 50 (2005) 1849–1861.
[5]	Y. L. Kao, K. C. Li, G. C. Tu, and C. A. Huang, Microstructural Study of the Effect of Chloride Ion on Electroplating of Copper in Cupric Sulfate-Sulfuric Acid Bath, Journal of The Electrochemical Society, 152 (9) C605-C611 (2005).
[6]	G. Fabricius and G. Sundholm, J. Appl. Electrochem., 15, 797 (1985).
[7]	A. Sato and R. Barauskas, Metal Finishing, 64th Guidebook and Directory Issue, 94 (1A), 214 (1996).
[8]	Schlesinger, M., Modern Electroplating, John Wiley, chapter. 2, 5th Edition, 2000
[9]	Kim, J.-H., Kim, R.-H., Kwon, H.-S., Preparation of copper foam with 3-dimensionally interconnected spherical pore network by electrodeposition, Electrochem. Communications 2008, 10, 1148-1151.
[10]	Nader Jalili, Karthik Laxminarayana, A review of atomic force microscopy imaging systems: application to the molecular metrology and biological sciences, Mechatronics 14 (2004) 907–945.
[11]	CHERYL R. BLANCHARD, Atomic Force Microscopy, Vol. 1, No. 5, I SSN 1 4 3 0 - 4 1 7 1, © 1 9 9 6 SPRINGER- VERLAG NEW YORK, INC.

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APA Style

Masoud Delgosha, Samira Salehi, Leila Unesi borujeni, Soheil Sharifi. (2014). AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface. Optics, 3(2), 15-18. https://doi.org/10.11648/j.optics.20140302.12

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ACS Style

Masoud Delgosha; Samira Salehi; Leila Unesi borujeni; Soheil Sharifi. AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface. Optics. 2014, 3(2), 15-18. doi: 10.11648/j.optics.20140302.12

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AMA Style

Masoud Delgosha, Samira Salehi, Leila Unesi borujeni, Soheil Sharifi. AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface. Optics. 2014;3(2):15-18. doi: 10.11648/j.optics.20140302.12

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@article{10.11648/j.optics.20140302.12,
  author = {Masoud Delgosha and Samira Salehi and Leila Unesi borujeni and Soheil Sharifi},
  title = {AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface},
  journal = {Optics},
  volume = {3},
  number = {2},
  pages = {15-18},
  doi = {10.11648/j.optics.20140302.12},
  url = {https://doi.org/10.11648/j.optics.20140302.12},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.optics.20140302.12},
  abstract = {The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.},
 year = {2014}
}

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TY  - JOUR
T1  - AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface
AU  - Masoud Delgosha
AU  - Samira Salehi
AU  - Leila Unesi borujeni
AU  - Soheil Sharifi
Y1  - 2014/07/20
PY  - 2014
N1  - https://doi.org/10.11648/j.optics.20140302.12
DO  - 10.11648/j.optics.20140302.12
T2  - Optics
JF  - Optics
JO  - Optics
SP  - 15
EP  - 18
PB  - Science Publishing Group
SN  - 2328-7810
UR  - https://doi.org/10.11648/j.optics.20140302.12
AB  - The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.
VL  - 3
IS  - 2
ER  -

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Author Information

Masoud Delgosha

Department of Physics, University of Sistan and Baluchestan, 98135-674 Zahedan, Iran
Samira Salehi

Department of Physics, University of Sistan and Baluchestan, 98135-674 Zahedan, Iran
Leila Unesi borujeni

Department of physics, ShahidRajaee Teacher Training University, Lavizan, Tehran 16788-15811,Iran
Soheil Sharifi

Department of Physics, Faculty of Sciences, Ferdowsi University of Mashhad, Mashhad 91775-1436, Iran

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Plain Text BibTeX RIS

APA Style

Masoud Delgosha, Samira Salehi, Leila Unesi borujeni, Soheil Sharifi. (2014). AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface. Optics, 3(2), 15-18. https://doi.org/10.11648/j.optics.20140302.12

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ACS Style

Masoud Delgosha; Samira Salehi; Leila Unesi borujeni; Soheil Sharifi. AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface. Optics. 2014, 3(2), 15-18. doi: 10.11648/j.optics.20140302.12

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AMA Style

Masoud Delgosha, Samira Salehi, Leila Unesi borujeni, Soheil Sharifi. AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface. Optics. 2014;3(2):15-18. doi: 10.11648/j.optics.20140302.12

Copy | Download

@article{10.11648/j.optics.20140302.12,
  author = {Masoud Delgosha and Samira Salehi and Leila Unesi borujeni and Soheil Sharifi},
  title = {AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface},
  journal = {Optics},
  volume = {3},
  number = {2},
  pages = {15-18},
  doi = {10.11648/j.optics.20140302.12},
  url = {https://doi.org/10.11648/j.optics.20140302.12},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.optics.20140302.12},
  abstract = {The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.},
 year = {2014}
}

Copy | Download

TY  - JOUR
T1  - AFM Studies of the Effect of Chloride Ion on the Morphology of the Copper Electroplating Surface
AU  - Masoud Delgosha
AU  - Samira Salehi
AU  - Leila Unesi borujeni
AU  - Soheil Sharifi
Y1  - 2014/07/20
PY  - 2014
N1  - https://doi.org/10.11648/j.optics.20140302.12
DO  - 10.11648/j.optics.20140302.12
T2  - Optics
JF  - Optics
JO  - Optics
SP  - 15
EP  - 18
PB  - Science Publishing Group
SN  - 2328-7810
UR  - https://doi.org/10.11648/j.optics.20140302.12
AB  - The influence of plating mode, chloride ion on morphology of copper deposits has been studied on pure copper substrate. The electroplating was conducted at 50mA/〖cm〗^2 , 25°C in cupric sulfate-sulfuric acid bath with various chloride additions 0.001-0.01 ml. The morphology and grain sizes of the electrodeposited copper were examined by atomic force microscopy. The maximum surface roughness and grain sizes of copper deposit were obtained when it was deposited with 0.01 ml of chloride ions. Small particles were observed on the surface of the copper film electroplated with the addition of chloride ions up to the amount of 0.001 ml.
VL  - 3
IS  - 2
ER  -

Copy | Download