Comparison of RFIC PA Die and Laminate Co-Simulation Methods

Liu Xilei; Dai Dajie; Chen Sidi; Yang Hanbing; Li Xuejian; Zhou Xianhua; Yue Bingdi

doi:doi:10.11648/j.jeee.20180604.12

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Comparison of RFIC PA Die and Laminate Co-Simulation Methods

Liu Xilei, Dai Dajie, Chen Sidi, Yang Hanbing, Li Xuejian, Zhou Xianhua, Yue Bingdi

Published in Journal of Electrical and Electronic Engineering (Volume 6, Issue 4)

Received: 18 September 2018 Accepted: 30 September 2018 Published: 29 October 2018

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Abstract

Package (such as LGA, MCM etc.) with main circuits on Die(s) situated on a substrate and with OMN in the substrate laminate is one of the most popular design styles for RFIC PAs in recent times. In practical design, the overall circuit of the RFIC PA is often designed using ADS Schematic simulation tool. The main circuit is then layout for Die design, and the OMN circuit is layout for laminate design. As the actual parasitics associated with the real RF circuits with high packing dense have significant effects on the RFIC performance, the traditional closed-form circuit models may be no longer valid, and co-simulations of the Die circuit or Die layout EM model and the laminate layout EM model are often considered in order to improve simulation accuracy. There are some generally considered co-simulation methods in practical design, such as Die circuit + Laminate Momentum, Die circuit +Laminate HFSS, Die layout Momentum +Laminate Momentum, Die layout Momentum +Laminate HFSS, Die layout +Laminate ADS Nested Technology, etc. Design engineers might be confused about which co-simulation methods should take for RFIC PA design and development. This paper reviews, compares and discusses the above co-simulation methods in the aspects of algorithms of the simulators, co-simulation modeling method, complexity to build model, run time, and the difference between simulation and measurement results by giving an example of a self-developed RFIC PA operating at 2GHz. It endeavors to draw helpful conclusions for simulation experiences in practical RFIC PA design, and a co-simulation method with Die layout Momentum EM model +Laminate HFSS EM model is recommended based on the software versions used in this work.

Published in	Journal of Electrical and Electronic Engineering (Volume 6, Issue 4)
DOI	10.11648/j.jeee.20180604.12
Page(s)	111-119
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2024. Published by Science Publishing Group

Keywords

Microelectronics Technology, RFIC PA, Die and Laminate Co-simulation Method, Comparison of Momentum, HFSS and ADS Nested technology

References

[1]	Chen Sidi, Zheng Yaohua, and Zhang Guohao. Design of a highly efficient and high harmonic suppression power amplifier [J]. Microelectronic Technology, 2015, vol. 41, No. 4:60-68.
[2]	Skyworks-Product-Datasheets –Amplifiers Category, Up to date (2018) available from website: http://www.skyworksinc.com
[3]	Quovo-Product-Datasheets-3G/4G Mobile Power Amplifier Category, Up to date(2018) available from website: http://www.qorvo.com
[4]	B Wan, X Wang. Overview of commercially-available analog/RF simulation engines and design environment. 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology.
[5]	I Delgado, S Skidmore, L Dunleavy. NI AWR Design Environment/Axiem EM co-simulation with Modelithics models. Wireless & Microwave Technology Conference, 2015:1-4.
[6]	TV Dinh, D Lesénéchal, B Domengès. Modeling and characterization of bond-wire arrays for distributed Chip-Package-PCB Co-design. Microwave Conference, 2015, 133:9-19.
[7]	S Koziel, A Bekasiewicz. EM-simulation-driven design optimization of compact microwave structures using multi-fidelity simulation models and adjoint sensitivities. International Journal of RF and Microwave Computer-Aided, 2016, 26 (5):442-448.
[8]	M Thompson, J Moore. Challenges and methodologies in EM simulation with circuit models. Bipolar/bicmos Circuits & Technology Meeting-bctm, 2015:20-26.
[9]	F Passos, E Roca, R Castro-López, et al. A strategy to efficiently include electromagnetic simulations in optimization-based RF circuit design methodologies. IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization for RF, Microwave, and Terahertz Applications (NEMO) 2017:64-66.
[10]	Bin Wan, Cindy Zhang, Xingang Wang. Multi-Technology Simulation with Mixed Design Environments. IEEE International Conference on Asic, 2016:1-4.
[11]	Xinqing Sheng. Essentials of Computational Electromagnetics (3rd Edition). China, Science Press, 2018: 1-217.
[12]	Hu Laiping and Liu Zhanjun. Comparison Among Computational Methods of Electromagnetics [J]. Modern Electronics Technique, 2003, No. 10: 75-78.
[13]	X Dong, T An. A new FEM approach for open boundary Laplace's problem. IEEE Transactions on Microwave Theory and Techniques 44(1):157 - 160 · February 1996.
[14]	T Eibert, V Hansen. Calculation of unbounded field problems in free space by a 3D FEM/BEM-hybrid approach. Journal of Electromagnetic Waves & Applications, 2012, 10 (1):61-78.
[15]	Xingfu Xu. ADS2011 Radio Frequency Circuit Design and Simulation Examples. China, Publishing House of Electronics Industry, May 2014: 1-523.
[16]	Xingfu Xu. HFSS Radio Frequency Simulation Design Case Studies. China, Publishing House of Electronics Industry, May 2015: 1-583.
[17]	Weimin Sun. Accurate EM Simulation of SMT Components in RF Designs. 2017 IEEE Radio Frequency Integrated Circuits Symposium.

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APA Style

Liu Xilei, Dai Dajie, Chen Sidi, Yang Hanbing, Li Xuejian, et al. (2018). Comparison of RFIC PA Die and Laminate Co-Simulation Methods. Journal of Electrical and Electronic Engineering, 6(4), 111-119. https://doi.org/10.11648/j.jeee.20180604.12

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ACS Style

Liu Xilei; Dai Dajie; Chen Sidi; Yang Hanbing; Li Xuejian, et al. Comparison of RFIC PA Die and Laminate Co-Simulation Methods. J. Electr. Electron. Eng. 2018, 6(4), 111-119. doi: 10.11648/j.jeee.20180604.12

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AMA Style

Liu Xilei, Dai Dajie, Chen Sidi, Yang Hanbing, Li Xuejian, et al. Comparison of RFIC PA Die and Laminate Co-Simulation Methods. J Electr Electron Eng. 2018;6(4):111-119. doi: 10.11648/j.jeee.20180604.12

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@article{10.11648/j.jeee.20180604.12,
  author = {Liu Xilei and Dai Dajie and Chen Sidi and Yang Hanbing and Li Xuejian and Zhou Xianhua and Yue Bingdi},
  title = {Comparison of RFIC PA Die and Laminate Co-Simulation Methods},
  journal = {Journal of Electrical and Electronic Engineering},
  volume = {6},
  number = {4},
  pages = {111-119},
  doi = {10.11648/j.jeee.20180604.12},
  url = {https://doi.org/10.11648/j.jeee.20180604.12},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.jeee.20180604.12},
  abstract = {Package (such as LGA, MCM etc.) with main circuits on Die(s) situated on a substrate and with OMN in the substrate laminate is one of the most popular design styles for RFIC PAs in recent times. In practical design, the overall circuit of the RFIC PA is often designed using ADS Schematic simulation tool. The main circuit is then layout for Die design, and the OMN circuit is layout for laminate design. As the actual parasitics associated with the real RF circuits with high packing dense have significant effects on the RFIC performance, the traditional closed-form circuit models may be no longer valid, and co-simulations of the Die circuit or Die layout EM model and the laminate layout EM model are often considered in order to improve simulation accuracy. There are some generally considered co-simulation methods in practical design, such as Die circuit + Laminate Momentum, Die circuit +Laminate HFSS, Die layout Momentum +Laminate Momentum, Die layout Momentum +Laminate HFSS, Die layout +Laminate ADS Nested Technology, etc. Design engineers might be confused about which co-simulation methods should take for RFIC PA design and development. This paper reviews, compares and discusses the above co-simulation methods in the aspects of algorithms of the simulators, co-simulation modeling method, complexity to build model, run time, and the difference between simulation and measurement results by giving an example of a self-developed RFIC PA operating at 2GHz. It endeavors to draw helpful conclusions for simulation experiences in practical RFIC PA design, and a co-simulation method with Die layout Momentum EM model +Laminate HFSS EM model is recommended based on the software versions used in this work.},
 year = {2018}
}

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TY  - JOUR
T1  - Comparison of RFIC PA Die and Laminate Co-Simulation Methods
AU  - Liu Xilei
AU  - Dai Dajie
AU  - Chen Sidi
AU  - Yang Hanbing
AU  - Li Xuejian
AU  - Zhou Xianhua
AU  - Yue Bingdi
Y1  - 2018/10/29
PY  - 2018
N1  - https://doi.org/10.11648/j.jeee.20180604.12
DO  - 10.11648/j.jeee.20180604.12
T2  - Journal of Electrical and Electronic Engineering
JF  - Journal of Electrical and Electronic Engineering
JO  - Journal of Electrical and Electronic Engineering
SP  - 111
EP  - 119
PB  - Science Publishing Group
SN  - 2329-1605
UR  - https://doi.org/10.11648/j.jeee.20180604.12
AB  - Package (such as LGA, MCM etc.) with main circuits on Die(s) situated on a substrate and with OMN in the substrate laminate is one of the most popular design styles for RFIC PAs in recent times. In practical design, the overall circuit of the RFIC PA is often designed using ADS Schematic simulation tool. The main circuit is then layout for Die design, and the OMN circuit is layout for laminate design. As the actual parasitics associated with the real RF circuits with high packing dense have significant effects on the RFIC performance, the traditional closed-form circuit models may be no longer valid, and co-simulations of the Die circuit or Die layout EM model and the laminate layout EM model are often considered in order to improve simulation accuracy. There are some generally considered co-simulation methods in practical design, such as Die circuit + Laminate Momentum, Die circuit +Laminate HFSS, Die layout Momentum +Laminate Momentum, Die layout Momentum +Laminate HFSS, Die layout +Laminate ADS Nested Technology, etc. Design engineers might be confused about which co-simulation methods should take for RFIC PA design and development. This paper reviews, compares and discusses the above co-simulation methods in the aspects of algorithms of the simulators, co-simulation modeling method, complexity to build model, run time, and the difference between simulation and measurement results by giving an example of a self-developed RFIC PA operating at 2GHz. It endeavors to draw helpful conclusions for simulation experiences in practical RFIC PA design, and a co-simulation method with Die layout Momentum EM model +Laminate HFSS EM model is recommended based on the software versions used in this work.
VL  - 6
IS  - 4
ER  -

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Author Information

Liu Xilei

School of Cultural Creativity and Tourism, Guangdong University of Finance & Economics, Guangzhou, China; Guangzhou Runxin Information Technology Co. Ltd, Guangzhou, China
Dai Dajie

Guangzhou Runxin Information Technology Co. Ltd, Guangzhou, China
Chen Sidi

Guangzhou Runxin Information Technology Co. Ltd, Guangzhou, China
Yang Hanbing

Guangzhou Runxin Information Technology Co. Ltd, Guangzhou, China
Li Xuejian

Guangzhou Runxin Information Technology Co. Ltd, Guangzhou, China
Zhou Xianhua

Guangzhou Runxin Information Technology Co. Ltd, Guangzhou, China
Yue Bingdi

Guangzhou Runxin Information Technology Co. Ltd, Guangzhou, China

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Plain Text BibTeX RIS

APA Style

Liu Xilei, Dai Dajie, Chen Sidi, Yang Hanbing, Li Xuejian, et al. (2018). Comparison of RFIC PA Die and Laminate Co-Simulation Methods. Journal of Electrical and Electronic Engineering, 6(4), 111-119. https://doi.org/10.11648/j.jeee.20180604.12

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ACS Style

Liu Xilei; Dai Dajie; Chen Sidi; Yang Hanbing; Li Xuejian, et al. Comparison of RFIC PA Die and Laminate Co-Simulation Methods. J. Electr. Electron. Eng. 2018, 6(4), 111-119. doi: 10.11648/j.jeee.20180604.12

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AMA Style

Liu Xilei, Dai Dajie, Chen Sidi, Yang Hanbing, Li Xuejian, et al. Comparison of RFIC PA Die and Laminate Co-Simulation Methods. J Electr Electron Eng. 2018;6(4):111-119. doi: 10.11648/j.jeee.20180604.12

Copy | Download

@article{10.11648/j.jeee.20180604.12,
  author = {Liu Xilei and Dai Dajie and Chen Sidi and Yang Hanbing and Li Xuejian and Zhou Xianhua and Yue Bingdi},
  title = {Comparison of RFIC PA Die and Laminate Co-Simulation Methods},
  journal = {Journal of Electrical and Electronic Engineering},
  volume = {6},
  number = {4},
  pages = {111-119},
  doi = {10.11648/j.jeee.20180604.12},
  url = {https://doi.org/10.11648/j.jeee.20180604.12},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.jeee.20180604.12},
  abstract = {Package (such as LGA, MCM etc.) with main circuits on Die(s) situated on a substrate and with OMN in the substrate laminate is one of the most popular design styles for RFIC PAs in recent times. In practical design, the overall circuit of the RFIC PA is often designed using ADS Schematic simulation tool. The main circuit is then layout for Die design, and the OMN circuit is layout for laminate design. As the actual parasitics associated with the real RF circuits with high packing dense have significant effects on the RFIC performance, the traditional closed-form circuit models may be no longer valid, and co-simulations of the Die circuit or Die layout EM model and the laminate layout EM model are often considered in order to improve simulation accuracy. There are some generally considered co-simulation methods in practical design, such as Die circuit + Laminate Momentum, Die circuit +Laminate HFSS, Die layout Momentum +Laminate Momentum, Die layout Momentum +Laminate HFSS, Die layout +Laminate ADS Nested Technology, etc. Design engineers might be confused about which co-simulation methods should take for RFIC PA design and development. This paper reviews, compares and discusses the above co-simulation methods in the aspects of algorithms of the simulators, co-simulation modeling method, complexity to build model, run time, and the difference between simulation and measurement results by giving an example of a self-developed RFIC PA operating at 2GHz. It endeavors to draw helpful conclusions for simulation experiences in practical RFIC PA design, and a co-simulation method with Die layout Momentum EM model +Laminate HFSS EM model is recommended based on the software versions used in this work.},
 year = {2018}
}

Copy | Download

TY  - JOUR
T1  - Comparison of RFIC PA Die and Laminate Co-Simulation Methods
AU  - Liu Xilei
AU  - Dai Dajie
AU  - Chen Sidi
AU  - Yang Hanbing
AU  - Li Xuejian
AU  - Zhou Xianhua
AU  - Yue Bingdi
Y1  - 2018/10/29
PY  - 2018
N1  - https://doi.org/10.11648/j.jeee.20180604.12
DO  - 10.11648/j.jeee.20180604.12
T2  - Journal of Electrical and Electronic Engineering
JF  - Journal of Electrical and Electronic Engineering
JO  - Journal of Electrical and Electronic Engineering
SP  - 111
EP  - 119
PB  - Science Publishing Group
SN  - 2329-1605
UR  - https://doi.org/10.11648/j.jeee.20180604.12
AB  - Package (such as LGA, MCM etc.) with main circuits on Die(s) situated on a substrate and with OMN in the substrate laminate is one of the most popular design styles for RFIC PAs in recent times. In practical design, the overall circuit of the RFIC PA is often designed using ADS Schematic simulation tool. The main circuit is then layout for Die design, and the OMN circuit is layout for laminate design. As the actual parasitics associated with the real RF circuits with high packing dense have significant effects on the RFIC performance, the traditional closed-form circuit models may be no longer valid, and co-simulations of the Die circuit or Die layout EM model and the laminate layout EM model are often considered in order to improve simulation accuracy. There are some generally considered co-simulation methods in practical design, such as Die circuit + Laminate Momentum, Die circuit +Laminate HFSS, Die layout Momentum +Laminate Momentum, Die layout Momentum +Laminate HFSS, Die layout +Laminate ADS Nested Technology, etc. Design engineers might be confused about which co-simulation methods should take for RFIC PA design and development. This paper reviews, compares and discusses the above co-simulation methods in the aspects of algorithms of the simulators, co-simulation modeling method, complexity to build model, run time, and the difference between simulation and measurement results by giving an example of a self-developed RFIC PA operating at 2GHz. It endeavors to draw helpful conclusions for simulation experiences in practical RFIC PA design, and a co-simulation method with Die layout Momentum EM model +Laminate HFSS EM model is recommended based on the software versions used in this work.
VL  - 6
IS  - 4
ER  -

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